In order to achieve the objectives of POLYNICES, the work-plan follows a step wise approach, organized and split into the following work packages (WPs):
Develop the fabrication process of highly planar polymer surfaces and low-loss single mode waveguides
Develop the process for accurate etching of recesses and grooves in the motherboard for flip-chipping of chiplets and micro-optical elements
Develop the flip-chip assembly process for photonics and electronics
Develop novel PZT phase actuators of low-power (<1 mW) and high speed (<0.1 µs), on TriPleX™ platform, for ultra-low-energy wavelength tuning and switching
Develop soldering process for photonics and electronics