POLYmer based electro-optic PCB motherboard integration with Si3N4 Chiplets, InP Components and Electronic ICs enabling affordable photonic modules for THz Sensing and quantum computing applications

POLYNICES is a research and innovation action that aims to provide a general-purpose photonic integration platform with all the cost, performance, scalability and manufacturability credentials for the next generation photonic modules. POLYNICES will develop a disruptive set of integration and packaging technologies that will allow low-cost photonic system in packages for a range of applications including wide band THz spectroscopy and quantum information processing.